PCB Depaneling / Separating


In order to achieve better results and increase the throughput of PCBs, often several components are consolidated, as a panel, in the manufacturing process. The subsequent separation of the panels is performed according to the customer’s, or jointly agreed specifications. Tectron offers your several separation methods, using the following tools:


  • milling machine


  • punch


  • wedge knife 


  • a rotating blade


Objective: Stress-free depaneling