PCB Depaneling / Separating

 

In order to achieve better results and increase the throughput of PCBs, often several components are consolidated, as a panel, in the manufacturing process. The subsequent separation of the panels is performed according to the customer’s, or jointly agreed specifications. Tectron offers your several separation methods, using the following tools:

 

  • milling machine

 

  • punch

 

  • wedge knife 

 

  • a rotating blade

 

Objective: Stress-free depaneling